Academics: Coursework and Reading Material
E3-262 Electronic Systems Packaging
Credits 2:1 August-December term every year
- G.V.Mahesh (24 hours)
- Venkat Natarajan, Intel (2 hours)
- Arun Chandrasekhar, Intel (8 hours)
- K B Vasanta, CEDT (Lab Instructor)
C Antonisamy, CEDT (Lab Instructor)
- Electronic systems and needs.
- Physical integration of circuits, packages, boards and full electronic systems.
- System applications like computer, automobile, medical and consumer electronics with case studies.
- Packaging levels; electrical design considerations- power distribution, signal integrity and parasitics; RF package design
- Power delivery in systems; CAD for Printed Wiring Boards (PWBs);
- Design for Manufacturability (DFM)
- PWB Technologies, Single-chip (SCM) and Multi-chip modules (MCM), flex circuits; recent trends in manufacturing like microvias, sequential build-up circuits and high-density interconnect structures.
- Materials in electronics packaging. Joining methods in electronics: lead-based and lead-free solders. Surface Mount technology- design, fabrication and assembly
- Embedded Passives, SOC vs SIP vs SOP concepts.
- Thermal management of PWBs, thermo-mechanical reliability, design for reliability and electrical test, Green packaging issues (lead-free soldering and assembly).
- Hands-on lab sessions in design, fabrication of microvia boards and embedded passives; assembly of surface mount devices and ball-grid arrays; lead-free assembly.
- Student seminars (two for the term; topics will be given by instructor in the class).
Suggested Reading and multimedia learning:
- Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.
- William D. Brown, Advanced Electronic Packaging, IEEE Press, 1999.
- Web-based Current literature.
- Class notes
- Multimedia learning on semiconductor processes and board fabrication/assembly processes.